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  • Description
Product Detail

    Multi layer

    Product design, system speed requirements, microprocessor and component scaling, and increased thermal performance are driving advances in PCB technology every day. Hemeixin’s technical and production capability and aggressive technology roadmap has kept pace with these changes and provides a scalable platform for growth.

     Layers (2-64)                                                  

     Lines and Spaces (Volume 3/3 Prototype 2/2)

     Controlled Impedance (+/- 10% Standard - +/- 5% Advanced)                             

     Blind and Buried Vias; Filled via capability                                                                                                               

     Buried Capacitance

      Dielectric thickness: 14 µm

      Capacitance /area: 6.4 nF/in2

      Breakdown Voltage: >100V

      3M material, no need license

     Buried Resistor

      Resistance (ohms/sq.) : 25, 50, 100, 200                                                                                                                                 

     Advanced thermal management and embedded coin technology
     High Performance and Emerging Materials; Halogen free,low     loss,ultra-thin,mixed packages, inlay
     Sequential Lamination

     High Tech Drilling Capability – Small hole drilling, Backdrilling  
     Mechanical depth control drilling with +/-10um tolerance,min drill
       size 0.15mm
     Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)

     


     

    Solution  


      


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Hemeixin Electronics Co.,Ltd

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