PCB Fab House
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Payment
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Origin
China Mainland
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Minimum Order
15
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Packing
Pieces
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- Description
Product Detail
Multi layer
Product design, system speed requirements, microprocessor and component scaling, and increased thermal performance are driving advances in PCB technology every day. Hemeixin’s technical and production capability and aggressive technology roadmap has kept pace with these changes and provides a scalable platform for growth.
• Layers (2-64)
• Lines and Spaces (Volume 3/3 Prototype 2/2)
• Controlled Impedance (+/- 10% Standard - +/- 5% Advanced)
• Blind and Buried Vias; Filled via capability
• Buried Capacitance
Dielectric thickness: 14 µm
Capacitance /area: 6.4 nF/in2
Breakdown Voltage: >100V
3M material, no need license
• Buried Resistor
Resistance (ohms/sq.) : 25, 50, 100, 200
• Advanced thermal management and embedded coin technology
• High Performance and Emerging Materials; Halogen free,low loss,ultra-thin,mixed packages, inlay
• Sequential Lamination
• High Tech Drilling Capability – Small hole drilling, Backdrilling
• Mechanical depth control drilling with +/-10um tolerance,min drill
size 0.15mm
• Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm)
Solution
- Sunstone PCB 15 Pieces / (Min. Order)
- PCB Creation 15 Pieces / (Min. Order)
- PCB Cost B 15 Pieces / (Min. Order)
- PCB Makers 15 Pieces / (Min. Order)
- PCB Cost A 15 Pieces / (Min. Order)
- PCB Suppliers 15 Pieces / (Min. Order)